Global Power Module Packaging Trends and Forecast Report 2019

In this report, the Electronics & Semiconductor market is valued at USD XX million in 2017 and is expected to reach USD XX million by the end of 2025, growing at a CAGR of XX% between 2017 and 2025. Electronics & Semiconductor market has been broken down by major regions, with complete market estimates on the basis of products/applications on a regional basis.

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A power electronic module or power module acts as a physical container for the storage of several power components, usually power semiconductor devices.

The market growth is driven by reduction in wastage of energy, use of efficient distributed cooling schemes, reduction in footprint, and consequent increase in power density. 

The global Power Module Packaging market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.

This report focuses on Power Module Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall Power Module Packaging market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.

At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:

Texas Instruments Incorporated

Star Automations

DyDac Controls

SEMIKRON

IXYS Corporation

Infineon Technologies AG

Mitsubishi Electric Corporation

Fuji Electric Co. Ltd.

Sanken Electric Co., Ltd.

SanRex Corporation

Segment by Regions

North America

Europe

China

Japan

Segment by Type

GaN Module

SiC Module

FET Module

IGBT Module

Thyristors

Segment by Application

Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)

Motors

Rail Tractions

Wind Turbines

Photovoltaic Equipment

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